Hyundai Mobis And Qualcomm Pen Comprehensive Agreement To Collaborate On SDV Architecture For ADAS
Hyundai Mobis to enhance performance, efficiency, and stability for advanced driver assistance systems using the Snapdragon Ride Flex system-on-chip
By Godson Umejiego, Bureau Chief, The Americas
Hyundai Mobis and Qualcomm Technologies, Inc. have announced that the companies have signed a comprehensive agreement at CES 2026 to co-develop next generation solutions for Software-Defined Vehicle (SDV) and Advanced Driver Assistance Systems (ADAS), Cyber Era NG learns.
We understand the MOU signing, held at the Hyundai Mobis booth, was attended by Executive Vice President and head of Automotive Electronics Business Unit, Jung Soo-Kyung and EVP and Group GM, Automotive, Industrial and Embedded IoT and Robotics, Qualcomm Technologies, Inc Nakul Duggal.
Through this collaboration, Hyundai Mobis and Qualcomm Technologies will jointly develop integrated solutions tailored for emerging markets while pursuing broader global supply opportunities by leveraging the combination of Hyundai Mobis’s expertise in system integration, sensor fusion, and perception with Qualcomm Technologies’ leadership in system‑on‑chip (SoC) technology.
The companies will begin their work with their co‑development of advanced driving and parking solutions based on the Snapdragon Ride™ Flex system-on-chip (SoC). These innovations will target fast‑growing markets such as India, where ADAS adoption is expanding across vehicle segments alongside rising demand for SDV‑ready architectures. For future SDV applications, they will also work together on next‑generation integrated solutions that combine Hyundai Mobis’s standardized software platform with Qualcomm Technologies’ Snapdragon® automotive technologies to enhance performance, efficiency, and stability.
